Hybrid volatile and non-volatile memory device with a shared interface circuit

ABSTRACT

A composite, hybrid memory device including a first storage die having an array of volatile storage cells and a second storage die having an array of non-volatile storage cells disposed within an integrated circuit package. The hybrid memory device includes a shared interface circuit to receive memory access commands directed to the first storage die and the second storage die and to convey read and write data between an external data path and the first and second storage dice.

CROSS-REFERENCE TO RELATED APPLICATIONS/TECHNICAL FIELD

Pursuant to 35 U.S.C. §365, this application claims priority fromInternational Application No. PCT/US2008/060566, published as WO2008/131058 A2 on Oct. 30, 2008, which claims priority from U.S.Provisional Application No. 60/912,321, filed Apr. 17, 2007 and entitled“Hybrid Volatile and Non-Volatile Memory Device”. InternationalApplication No. PCT/US2008/060566 and U.S. Provisional Application No.60/912,321 are hereby incorporated by reference in their entirety.

The disclosure herein relates to data processing and more particularlyto data storage devices.

BACKGROUND

Many modern data processing systems include both volatile DRAM (dynamicrandom access memory) for mass storage and non-volatile Flash memory forpower-down data retention. Due to process incompatibilities, however,the DRAM and Flash are typically implemented in separate integratedcircuit devices having distinct control and data interfaces and disposedin distinct regions of an integrated circuit board. With regard to theindividual memory characteristics, the need to regenerate and reloaddata into the DRAM device at boot-up (or wake-up) delays systemreadiness, and Flash memory devices suffer from relatively slow accesstimes and write-limiting degradation. If DRAMs were non-volatile,computers, cell phones and other electronic systems could start up andwake up more quickly, and if Flash memory was faster and did not wearout, it could be used as a device's mass storage.

BRIEF DESCRIPTION OF THE DRAWINGS

The disclosure herein is illustrated by way of example, and not by wayof limitation, in the figures of the accompanying drawings and in whichlike reference numerals refer to similar elements and in which:

FIG. 1A illustrates an embodiment of a hybrid, composite memory devicehaving a non-volatile storage IC, volatile storage IC andshared-interface IC;

FIG. 1B illustrates an alternative hybrid memory device embodiment inwhich the shared interface circuitry is implemented in the non-volatilestorage device;

FIG. 2 illustrates an embodiment of a hybrid, composite memory devicewith the shared interface circuitry shown in greater detail and with thevolatile and non-volatile memories being implemented by a DRAM memorydie and Flash memory die, respectively;

FIG. 3 illustrates an embodiment of a data control/steering circuit thatmay be used to implement the data control/steering circuit of FIG. 2,depicting exemplary interconnections with the DRAM and NV controlcircuits and also the volatile and non-volatile memory dice;

FIG. 4 illustrates an exemplary embodiment of an address comparatorcircuit that may be implemented within the command decoder of FIG. 2;

FIG. 5 illustrates an exemplary memory shadowing operation;

FIG. 6 illustrates the general nature of a configurable overlappingaddress range between the volatile storage die (DRAM in this example)and non-volatile storage die; and

FIG. 7 illustrates an embodiment of an address comparator circuit thatmay be used to determine whether a memory access is directed to thededicated volatile storage, dedicated non-volatile storage, or shadowedmemory space within a configurable-overlap, hybrid memory device.

DETAILED DESCRIPTION

A hybrid, composite memory device having non-volatile and volatilememories implemented in distinct integrated circuit (IC) dice that arepackaged together and accessed through a shared interface is disclosedin various embodiments. By fabricating the non-volatile and volatilememories in separate ICs, processes that have developed for optimizingthe performance of each die may be followed, avoiding the compromisestypically required to merge the different storage technologies in acommon process. Also, because a shared interface is provided, the memorycontrol function and interface of the system may be simplified.Additionally, through provision of additional control circuitry withinthe volatile memory IC, non-volatile memory IC or separate control IC,some or all of the volatile memory may be shadowed by the non-volatilememory, synergistically providing the benefits of both memory types. Forexample, in one application of the hybrid memory device, a DRAM memoryis provided for relatively high-speed memory access and degradation-freeperformance, with systematic write-back from the DRAM to a Flash memoryto provide a non-volatile image of the DRAM contents which may bequickly restored from the Flash memory to the DRAM for rapid deviceboot-up and wake-up. In effect, the hybrid memory device functions as anon-volatile DRAM, having the fast-access and degradation-freeperformance of a DRAM and the non-volatile characteristics of a Flashmemory.

Hybrid Memory Architecture (HMA)

FIG. 1A illustrates an embodiment of a hybrid, composite memory device100 having a non-volatile storage IC 101, volatile storage IC 103 andshared-interface IC 105. More specifically, in the embodiment shown andother embodiments disclosed herein, the non-volatile storage IC 101(also referred to herein as a non-volatile memory die) is implemented bya Flash memory die (non-volatile storage based on block-erasedfloating-gate metal-oxide-semiconductor memory) of either the NAND-Flashor NOR-Flash varieties, though any other electrically-erasable orelectrically-alterable storage technology may alternatively be used.Similarly, the volatile storage IC 103 (also referred to herein as avolatile memory die) is implemented by a DRAM die (single transistor,single capacitor storage cell), though static random access memory(SRAM), reduced-transistor DRAM or any other type of volatile storagetechnology may be used in alternatives to the embodiments of FIG. 1A andother Figures described below.

As shown, the shared interface 105 includes a uni-directional controlinterface 102 (or request interface or command interface) to receivecommands from a controller device (not shown in FIG. 1A), and abi-directional data interface 104 to receive data from and output datato the controller device. In one embodiment, the control and datainterfaces are implemented in a manner that corresponds to standardsynchronous or asynchronous non-volatile memory devices. For example, asshown at 110, the control interface may present a conventionalsynchronous or asynchronous DRAM interface to the memory controller, andthus receive read-address-strobe (RAS), column-address-strobe (RAS),write-enable (WE) and output-enable (OE) signals from the memorycontroller along with clock and clock-enable signals (not specificallyshown). Alternatively, the control interface 102 may receive read-enableand write-enable signals (REN, WEN as shown at 112) as in a flash memoryor SRAM implementation. Also, the control interface 102 may additionallyinclude dedicated address lines to receive memory read and writeaddresses from the memory controller, or the address information may betime-multiplexed onto the control lines or data lines. The data linesand/or control lines may be accompanied by source-synchronous timingsignals such as strobe or clock signals that transition in a desiredphase alignment with respect to valid-signal windows (data eyes) in thedata and control signals and thus may be used to precisely control thesampling of those signals within the shared interface 105.

Internally, the shared interface 105 includes circuitry to forwardcontrol and data signals to the appropriate memory die, convertingsignals from the external data access protocol to an internal dataaccess protocol as necessary. For example, in an embodiment having aDRAM external interface, control and data signals may be forwardedwithout change to a DRAM die (or with data serialization ordeserialization to compensate for differences in path width between theinternal and external data and/or control paths), but may be convertedfrom DRAM format to Flash memory format before being forwarded to theFlash memory device. In general, any external protocol may be used toaccess the hybrid memory device, and any internal protocol or set ofprotocols may be used to control the volatile and non-volatile storagedice. Further, while only two storage dice are shown, multiplenon-volatile storage dice and/or multiple volatile storage dice may beprovided and selected by the shared interface circuitry based onincoming address and/or control signals. In such instances, the multiplevolatile storage dice may be identical, or may be different in variousregards, including storage capacity, storage technology (e.g., one ormore SRAM dice may be packaged with one or more DRAM device), and/or themultiple non-volatile storage dice may be identical or mixed as where aFlash memory device is packaged with one or more ROM devices to form asystem in package.

FIG. 1B illustrates an alternative hybrid memory device embodiment 114in which the shared interface circuitry is implemented in a non-volatilestorage device 115. That is, rather than providing a dedicated die(e.g., an application-specific IC (ASIC) or the like) to carry out theshared interface functions, the shared-interface circuitry is fabricatedwithin an area of the non-volatile storage device 115 and thus forwardson-die control signals 106 to the non-volatile core (after performingany necessary protocol conversion), and forwards control and datasignals 108 off die to the volatile storage die 103. Similarly, dataoutput from the volatile storage die is transferred from the volatilestorage die to the shared interface on the non-volatile storage diebefore being output onto the external data path 104. Note that if eitherof the two storage die transistor technologies is suited toimplementation of logic circuitry such as that of the shared interface,then that die may alternatively be used to host the shared interfacecircuitry. Further, while the shared interface circuitry is generallydescribed and shown as implemented on a distinct, dedicateshared-interface IC in the embodiments described below, in all suchembodiments, the shared interface circuitry may be disposed on either avolatile memory die or non-volatile memory die. With respect to dieorientation, the dice within the hybrid memory device may be disposedside-by-side, stacked over one another or, where there are more than twodice, disposed both in a side-by-side arrangement and stacked over oneanother (e.g., shared interface die disposed adjacent a stack of storagedice, or two or more separate stacks of storage dice). Also, variousdifferent three-dimensional (3D) packaging techniques maybe used tointerconnect the dice within the hybrid memory device including, forexample and without limitation, die-to-die wire bonding,flip-chip-interconnect or wire-bond-interconnect through conductivestructures in the package substrate, thru-silicon vias, flex-tape,die-in-substrate encapsulation, direct wafer bonding, proximityinterconnect (e.g., inductively coupled or capacitively coupledinterconnects), and so forth. In any of these variants, the hybridmemory device may include an encapsulating structure or other housingdisposed over the interface die and storage die to form anintegrated-circuit (IC) package.

FIG. 2 illustrates an embodiment of a hybrid, composite memory devicewith the shared interface circuitry shown in greater detail and with thevolatile and non-volatile memories being implemented by a DRAM die 103and Flash memory die 101, respectively. As discussed, other types ofvolatile and non-volatile memories may be used. In the embodiment shown,the shared interface circuitry includes an external request interface125, external data interface 133, command decoder 122, address queue135, DRAM control circuit 129, Flash control circuit 137, and datacontrol/steering circuit 131. In one embodiment, incoming controlsignals and addresses (collectively referred to herein as memory accessrequests or commands) are received in the external request interface 125via control/address (CA) path 126, reformatted as necessary (e.g.,deserialized to form a parallel command word and one or more addressvalues) and then forwarded to the command decoder 122. The commanddecoder 122 in turn forwards address to the address queue 135 and storesmemory access commands (read and write requests, at least, which mayinclude more primitive commands such as activation commands, columnaccess commands and precharge commands used to carry out memory accessesin the DRAM and, similar primitive commands for accessing a non-volatilestorage) in an internal command queue. In one embodiment, referred toherein as the hybrid storage embodiment, non-overlapping address rangesapply to each of the storage dice 101 and 103 to form the overalladdressable range of the composite memory device. By this arrangement,and by providing a comparator circuit within the command decoder 122 todetermine whether the address component of a memory access command fallswithin the range of addresses allocated to the non-volatile or volatilestorage, memory access operations may be automatically directed toeither the volatile storage die or non-volatile storage die according tothe memory address to be accessed. FIG. 4 illustrates an exemplaryembodiment of an address comparator circuit that may be implementedwithin the command decoder of FIG. 2. As shown, the comparator circuit181 compares the incoming address 178 with a predetermined (orprogrammatically established) memory address, NV-start 180, that marksthe start of the non-volatile memory address range. In the embodimentshown, the non-volatile storage 101 is assumed to be mapped to the upperportion of the total device address range (in other embodiments, thelower portion could alternatively be used) so that, if the incomingaddress is greater than or equal to NV-start, the memory address fallswithin the non-volatile memory address range and the comparator outputsa memory select signal (MSel) 182 in a first logic state (e.g., logic‘1’) to enable access to the non-volatile memory die 101. If theincoming address is less than NV-start 180, the comparator outputs MSel182 in a second logic state (e.g., logic ‘0’) to enable access to thevolatile memory die 103. Note that in the embodiment shown, the storagedie selection may be signaled by the most significant bit of theincoming address (e.g., 0=DRAM, 1=Flash) or by some number of bitswithin the incoming address. In an alternative embodiment, a dedicatedbit within the memory access request (other than an address bit) may beused to enable access to either the volatile storage die or non-volatilestorage die.

Returning to FIG. 2, the command decoder 122 outputs, from the head ofthe command queue, an enable signal and corresponding memory accesscontrol signals to the DRAM control circuit 129 and NV control circuit137. In one embodiment, each memory access is directed to either theDRAM die or the Flash memory die, though accesses may be overlapped atleast in part to enable multiple accesses to the DRAM to be carried outwhile awaiting a memory read or programming operation (memory write)within the slower non-volatile die. Also, operations within either ofthe storage dice may be pipelined with other operations within that samestorage die or with operations directed to the alternate storage die.

Considering a DRAM access first, when the DRAM control circuit 129detects assertion of the DRAM enable signal, the DRAM control circuit129 initiates a memory access operation within the DRAM storage die inaccordance with the memory access command signaled by the commanddecoder 122. More specifically, in one embodiment, the command decoder122 outputs DRAM primitive commands (activate, column access, precharge,refresh) to the DRAM control circuit which responds in turn byoutputting row address strobe (RAS) and column-address-strobe (CAS)signals 146 to the DRAM storage die at the appropriate time to stroberow and column addresses (retrieved from the head of the address queue)into the DRAM memory array die 103 and thus initiate row activation,column access (i.e., memory read or memory write) and prechargeoperations. Similarly, when the NV control circuit 137 detects assertionof an NV-enable signal, the NV control circuit 137 initiates a memoryaccess operation within the non-volatile storage die in accordance withthe signaled memory access command. In the particular example shown inFIG. 2, for instance, the NV control circuit 137 asserts a read-enablesignal or write-enable signal 148 according to the queued memory accesscommand, to initiate a read or write memory access in the NV storage dieat the location specified by the address queue.

The data control/steering circuit 131 is used to control the transfer ofdata between a shared internal data bus and dedicated internal databuses associated with the volatile and non-volatile storage dice,respectively. The shared internal data bus is coupled to the externaldata interface 133, which transfers read and write data between theshared internal data bus and external data path. The external datainterface 133 may be a synchronous or asynchronous interface, and mayperform a multiplexing function (sometimes referred to as adeserializing function) by converting a sequence of relatively narrowdata words received at a relatively high frequency via the external datapath 128, to a lower frequency, wider-data-word sequence on the primaryinternal data path 140, and performing the reverse operation(serializing) for data flow from primary internal data path 140 toexternal data path 128. In alternative embodiments, the external pathmay be wider and/or slower than the primary internal data path.Similarly, the data steering and control circuit 131 may perform aserializing/deserializing function for data transferred between theshared internal data path 140 and the volatile-die data path 142 and/orbetween the shared internal data path 140 and the non-volatile-die datapath 144.

FIG. 3 illustrates an embodiment of a data control/steering circuit 150that may be used to implement the data control/steering circuit 131 ofFIG. 2, depicting exemplary interconnections with the DRAM and NVcontrol circuits 129, 137 and also the volatile and non-volatile memorydice. As shown, the data control/steering circuit 150 includes datacontrol circuit 151, multiplexer 153, secondary volatile andnon-volatile data paths 155 and 157 (secondary as opposed to primaryvolatile and non-volatile data paths 142 and 144), volatile-storage-dieinterface buffer 159, non-volatile-storage-die interface buffer 161, andinter-die data path 171. The data control circuit 151 receives controlsignals from the command decoder that indicate the direction of dataflow during a memory access operation (read or write) and whether thevolatile or non-volatile storage die is the target of the memory access.In a memory write operation, data received via shared internal data path140 is passed, via multiplexer 153, to one of the secondary data paths155, 157 according to the memory access target (e.g., indicated bymemory-select signal MSel as described in reference to FIG. 4). If thevolatile storage die 103 is the target of the memory write, the datacontrol circuit 151 switches the multiplexer 153 to convey data from theshared internal path 140 to secondary data path 155, and signals theDRAM interface buffer 159 to enable the data to be buffered (or queued)therein for eventual transfer to the DRAM die via data path 142. Thedata control circuit 151 issues a synchronizing signal to the DRAMcontrol circuit 129 to enable generation of RAS and CAS signals 146therein at a time that coincides with output of the corresponding writedata from the DRAM interface buffer 159. Conversely, in a data readoperation, the data control circuit 151 asserts a synchronizing signalto the DRAM control circuit 129 to initiate assertion of RAS and CASsignals 146 to enable data to be read out of the DRAM die from aspecified address (e.g., supplied by the address queue of FIG. 2) andconveyed, via data path 142, to the DRAM interface buffer 159.Thereafter, the data is read out of the DRAM interface buffer 159 ontothe secondary data path 155, and then passed through multiplexer 153onto shared data path 140. As described above, the read data is conveyedvia the shared data path 140 to external data interface 133 of FIG. 2,which includes one or more output driver circuits to output the dataonto external data path 128. Alternatively, the data read out of thevolatile storage die may be transferred from the volatile-die interfacebuffer 159 to the non-volatile-die interface buffer 161 via theinter-die data path 171. The transferred data may then be stored in thenon-volatile storage die to implement a memory shadowing function asdescribed below. Data may similarly be transferred in the oppositedirection from the non-volatile die 101 to the volatile storage die 103via inter-die data path 171 (i.e., transferring the data from buffer 161to buffer 159), for example, to restore the state of the volatilestorage die 103 to a pre-power-down or pre-sleep condition.

Data transfer between the shared internal data path 140 and thenon-volatile storage die is fundamentally similar to that of thevolatile data path. That is, in a memory write operation directed to thenon-volatile storage die 101, the data control circuit 151 switches themultiplexer 153 to convey data from the shared internal path 140 tosecondary data path 157 and signals the non-volatile-die interfacebuffer 161 to enable the data to be buffered (or queued) therein foreventual transfer to the non-volatile storage die via data path 144. Thedata control circuit 151 issues a synchronizing signal to thenon-volatile control circuit 137 to enable generation of a write-enablesignal (WEN) 148 therein at a time that coincides with output of thecorresponding write data from the non-volatile-die interface buffer 161.Conversely, in a data read operation, the data control circuit 151asserts a synchronizing signal to the non-volatile-die control circuit137 to initiate assertion of a read-enable signal (REN) 148 to enabledata to be read out of the non-volatile storage die from a specifiedaddress (e.g., supplied by the address queue of FIG. 2) and conveyed,via data path 144, to the non-volatile-die interface buffer 161.Thereafter, the data is read out of the non-volatile-die interfacebuffer 161 onto the secondary data path 157, and then passed throughmultiplexer 153 onto shared data path 140. As described above, the readdata is conveyed via the shared data path 140 to external data interface133 of FIG. 2, which includes one or more output driver circuits tooutput the data onto external data path 128.

Still referring to the embodiment of FIG. 3, the data control portion ofthe interface die manages the read and write and MUX-control commands tocoordinate data transfers between the external data path and thevolatile and non-volatile storage dice, as well as the die-to-dietransfers. In some embodiments, this coordination will use parametersassociated with relative access times and storage capacities of the twotypes of storage die. In some embodiments, these parameters may beprogrammatically controlled. In addition to access time and storagecapacity parameters, some embodiments may also include a minimumtransfer size parameter, as the non-volatile memory die and the volatilememory die may have different access granularities. For example, aNAND-type non-volatile Flash memory may have a 4 kB (32768 bits) “pagesize” that is the minimum amount of data that may be read or writtenduring a given transaction. In contrast, a NOR-type non-volatile Flashor a volatile DRAM memory device may have a much smaller minimum: forexample, 32 bits. The minimum transfer size parameter may be chosen tobe the larger of the two minimums. In the above example, for instance, aminimum of 4 kB of data may transferred between the volatile andnon-volatile storage dice during any transfer operation.

Shadow Operation

In hybrid memory architectures described so far, the volatile andnon-volatile storage devices have been assumed to have non-overlappingaddress ranges. In alternative embodiments, including production-time orrun-time configurable embodiments, some or all of the volatile memoryaddress range may overlap with the non-volatile memory address range toenable an operation referred to herein as memory shadowing. In memoryshadowing, memory accesses are directed first to the non-volatilestorage device to enable relatively high-speed, non-degrading memoryaccesses, with the data eventually being written-back (retired orrecorded) within the non-volatile storage in response to a triggeringevent referred to herein as a write-back trigger. Applications of memoryshadowing include non-volatile DRAM, and rapid-access non-volatilememory.

FIG. 5 illustrates an exemplary memory shadowing operation. Initially,at (A), data is stored in a fast-access volatile storage die at aspecified address (indicated by location 203), and a write-back tablewithin the volatile storage die is updated. As shown at 201 thewrite-back table may include a start address, end address andentry-valid bit (V) for entries stored in respective rows of the table(e.g., entry 0, entry 1, entry 2, etc. as indicated by the subscriptedstart address, end address and entry-valid bits). Note that thewrite-back table may be maintained in a location other than the volatilestorage die (or at least outside the volatile storage array), such as inan SRAM memory buffer or other memory element within the sharedinterface circuitry. Some time after one or more data write operationshave been performed, a write-back trigger is detected within the sharedinterface circuitry and, in response, one or more internal data transferoperations are performed to transfer data from the locations indicatedby the write-back table to be dirty (i.e., updated within the volatilestorage die relative to the same-address contents of the non-volatilestorage die, as shown by location 203) from the DRAM to correspondinglocations (e.g., 205) within the NV memory. After the write-backoperations are complete, the corresponding entry-valid bits for thenow-coherent data storage (i.e., same-valued data in both the volatileand non-volatile storage devices) are reset or otherwise cleared toindicate that those entries are no longer valid. In one embodiment, theoverlapping regions of non-volatile and volatile memory share the samephysical addresses within their respective storage die, so the memoryshadowing operation involves transferring data from dirty locationswithin the volatile storage die to like locations within thenon-volatile storage die. Alternatively, address translation may beperformed to correlate entries within the non-volatile storage die tocounterpart entries within the volatile storage die.

The write-back trigger itself may include any number or combination ofstimuli, including detecting that the write-back table has a thresholdnumber of valid entries; periodically performing write-back (e.g., afterevery so many writes to the non-volatile storage and/or after apredetermined or configurable amount of time has elapsed); detecting apower-loss or power-down signal or event (i.e., performing all necessarywrite-backs—an operation referred to herein as flushing the write-backtable—as part of power down), receiving an explicit command to flush thewrite-back table or otherwise perform one or more write-back operationsand so forth.

Still referring to FIG. 5, although the write-back table is depicted asdefining, in each table entry (or row), a memory range bounded by astart and end address, the memory range may alternatively be fixed andthus denoted only by a start address. Also, a start address or endaddress and run-length value may be used to define the memory range.Further, the entry-valid bit may be omitted, with identical startend-addresses or end-address<start address used to denote invalid orunused table entries. Also, a new entry within the write-back table isnot required for each write to the volatile storage device. For example,the control circuit may determine that the memory locations updated in agiven write operation are already encompassed by an entry within thewrite-back table (and thus already marked as dirty) or that the updatedmemory locations are near enough to a dirty region defined within awrite-back table entry such that the start address and/or end address ofthe entry may be modified to extend the dirty region to include thenewly updated locations.

FIG. 6 illustrates the general nature of a configurable overlappingaddress range between the volatile storage die 103 (DRAM in thisexample) and non-volatile storage die 101. As shown, a start-of-overlapaddress (SOO) represents the lowest address within the shadowed memoryspace (i.e., overlapped address range), and an end-of-overlap address(EOO) represents the highest address within the shadowed memory space.In alternative embodiments, the total size of the shadowed memory spacemay be fixed so that only the end-of-overlap or start-of-overlapaddresses need be explicitly provided, with the unspecified boundarithmetically determinable. Addresses below the start-of-overlap definea dedicated volatile-storage region within the hybrid memory device, andaddresses above the end-of-overlap define a dedicated non-volatileregion within the hybrid memory device. In the event that the volatileand non-volatile storage die have matching capacity, the shadowed memoryspace may be configured to consume the entire storage space of bothdevices by setting the start-of-overlap address and end-of-overlapaddress to the minimum and maximum address values, respectively, of thecapacity of either storage die. Also, in some embodiments, thestart-of-overlap and/or end-of-overlap values may be reprogrammed duringthe course of normal operation of the hybrid memory device (i.e.,configuration of the device need not limited to a one-timeinitialization).

FIG. 7 illustrates an embodiment of an address comparator circuit 223that may be used to determine whether a memory access is directed to thededicated volatile storage, dedicated non-volatile storage, or shadowedmemory space within a configurable-overlap, hybrid memory device. Asshown, the address comparator circuit includes a run-time orproduction-time programmable register 230 to hold start-of-overlap (SOO)and end-of-overlap (EOO) address values (i.e., the register 230 may beloaded in response to host instruction with host-suppliedstart-of-overlap and end-of-overlap address values), a pair ofcomparators 231 and 233, and a logic circuit 235 to enable access toeither the volatile storage 225, non-volatile storage 229, or shadowedmemory space 227, according to the output of the comparators 231 and233. In the embodiment shown, an incoming write address 178 is suppliedto the ‘+’ input of comparator 231 and the ‘−’ input of comparator 233,with the ‘−’ input of comparator 231 coupled to receive thestart-of-overlap address from register 230, and the ‘+’ input ofcomparator 233 coupled to receive the end-of-overlap address fromregister 230. By this arrangement, comparator 231 will output a logichigh or low comparison result state according to whether the incomingwrite address is exceeds (or is equal to) the start-of-overlap address,and comparator 233 will similarly output a logic high or low comparisonresult according to whether the write address exceeds (or is equal to)the end-of-overlap address. Thus, if both the comparison results are ina first logic state (indicating that write address>=SOO and writeaddress<=EOO), the logic circuit 235 will output a signal indicatingthat a shadowed memory operation is to take place, including updatingthe write-back table as necessary (i.e., as described in reference toFIG. 5). By contrast, if the comparison results indicate that the writeaddress is less than the start-of-overlap address or greater than theend-of-overlap address, the logic circuit 235 may issue enable signalsto the corresponding volatile-storage control circuitry or non-volatilestorage control circuitry to enable access to the dedicated volatilestorage or non-volatile storage regions therein.

It should be noted that the various circuits disclosed herein may bedescribed using computer aided design tools and expressed (orrepresented), as data and/or instructions embodied in variouscomputer-readable media, in terms of their behavioral, registertransfer, logic component, transistor, layout geometries, and/or othercharacteristics. Formats of files and other objects in which suchcircuit expressions may be implemented include, but are not limited to,formats supporting behavioral languages such as C, Verilog, and VHDL,formats supporting register level description languages like RTL, andformats supporting geometry description languages such as GDSII, GDSIII,GDSIV, CIF, MEBES and any other suitable formats and languages.Computer-readable media in which such formatted data and/or instructionsmay be embodied include, but are not limited to, non-volatile storagemedia in various forms (e.g., optical, magnetic or semiconductor storagemedia) and carrier waves that may be used to transfer such formatteddata and/or instructions through wireless, optical, or wired signalingmedia or any combination thereof. Examples of transfers of suchformatted data and/or instructions by carrier waves include, but are notlimited to, transfers (uploads, downloads, e-mail, etc.) over theInternet and/or other computer networks via one or more data transferprotocols (e.g., HTTP, FTP, SMTP, etc.).

When received within a computer system via one or more computer-readablemedia, such data and/or instruction-based expressions of the abovedescribed circuits may be processed by a processing entity (e.g., one ormore processors) within the computer system in conjunction withexecution of one or more other computer programs including, withoutlimitation, net-list generation programs, place and route programs andthe like, to generate a representation or image of a physicalmanifestation of such circuits. Such representation or image maythereafter be used in device fabrication, for example, by enablinggeneration of one or more masks that are used to form various componentsof the circuits in a device fabrication process.

In the foregoing description and in the accompanying drawings, specificterminology and drawing symbols have been set forth to provide athorough understanding of the present invention. In some instances, theterminology and symbols may imply specific details that are not requiredto practice the invention. For example, any of the specific numbers ofbits, signal path widths, signaling or operating frequencies, componentcircuits or devices and the like may be different from those describedabove in alternative embodiments. Also, the interconnection betweencircuit elements or circuit blocks shown or described as multi-conductorsignal links may alternatively be single-conductor signal links, andsingle conductor signal links may alternatively be multi-conductorsignal links. Signals and signaling paths shown or described as beingsingle-ended may also be differential, and vice-versa. Similarly,signals described or depicted as having active-high or active-low logiclevels may have opposite logic levels in alternative embodiments.Component circuitry within integrated circuit devices may be implementedusing metal oxide semiconductor (MOS) technology, bipolar technology orany other technology in which logical and analog circuits may beimplemented. With respect to terminology, a signal is said to be“asserted” when the signal is driven to a low or high logic state (orcharged to a high logic state or discharged to a low logic state) toindicate a particular condition. Conversely, a signal is said to be“deasserted” to indicate that the signal is driven (or charged ordischarged) to a state other than the asserted state (including a highor low logic state, or the floating state that may occur when the signaldriving circuit is transitioned to a high impedance condition, such asan open drain or open collector condition). A signal driving circuit issaid to “output” a signal to a signal receiving circuit when the signaldriving circuit asserts (or deasserts, if explicitly stated or indicatedby context) the signal on a signal line coupled between the signaldriving and signal receiving circuits. A signal line is said to be“activated” when a signal is asserted on the signal line, and“deactivated” when the signal is deasserted. Additionally, the prefixsymbol “/” attached to signal names indicates that the signal is anactive low signal (i.e., the asserted state is a logic low state). Aline over a signal name (e.g., ‘ <signal name>’) is also used toindicate an active low signal. The term “coupled” is used herein toexpress a direct connection as well as a connection through one or moreintervening circuits or structures. Integrated circuit device“programming” may include, for example and without limitation, loading acontrol value into a register or other storage circuit within the devicein response to a host instruction and thus controlling an operationalaspect of the device, establishing a device configuration or controllingan operational aspect of the device through a one-time programmingoperation (e.g., blowing fuses within a configuration circuit duringdevice production), and/or connecting one or more selected pins or othercontact structures of the device to reference voltage lines (alsoreferred to as strapping) to establish a particular device configurationor operation aspect of the device. The term “exemplary” is used toexpress an example, not a preference or requirement.

While the invention has been described with reference to specificembodiments thereof, it will be evident that various modifications andchanges may be made thereto without departing from the broader spiritand scope of the invention. For example, features or aspects of any ofthe embodiments may be applied, at least where practicable, incombination with any other of the embodiments or in place of counterpartfeatures or aspects thereof. Accordingly, the specification and drawingsare to be regarded in an illustrative rather than a restrictive sense.

What is claimed is:
 1. A memory device disposed within an integratedcircuit (IC) package and comprising: a first storage die having an arrayof volatile storage cells; a second storage die having an array ofnon-volatile storage cells; a shared interface circuit coupled to thefirst storage die and the second storage die to receive informationassociated with a memory access operation to be performed within thememory device, the information specifying an access to either the firstor the second storage die, the shared interface circuit includingselection circuitry responsive to the information to select, accordingto the information, either the first storage die or the second storagedie to be accessed in the memory access operation.
 2. The memory deviceof claim 1 wherein the information associated with the memory accessoperation comprises an address value, and wherein the shared interfacecircuit comprises a circuit to select, according to one or more bits ofthe address value, either the first storage die or the second storagedie to be accessed in the memory access operation.
 3. The memory deviceof claim 1 wherein the information associated with the memory accessoperation comprises a memory access command that indicates the memoryaccess operation to be performed and which of the first and secondstorage dice is to be accessed in the memory access operation, andwherein the shared interface circuit comprises a circuit to select,according to one or more bits of the memory access command, either thefirst storage die or the second storage die to be accessed in the memoryaccess operation.
 4. The memory device of claim 1 wherein the sharedinterface circuitry comprises circuitry to receive memory accesscommands directed to the first storage die and the second storage dieand to convey read and write data between an external data path and thefirst and second storage dice in response to the memory access commands.5. The memory device of claim 1 wherein the shared interface circuit isdisposed within the IC package on a third die.
 6. The memory device ofclaim 1 wherein the shared interface circuit is formed at least in parton at least one of the first and second storage dice.
 7. The memorydevice of claim 1 wherein the first storage die is a dynamic randomaccess memory (DRAM) die comprising an array of DRAM cells.
 8. Thememory device of claim 1 wherein the first storage die is a staticrandom access memory (SRAM) die comprising an array of SRAM cells. 9.The memory device of claim 1 wherein the second storage die is a Flashmemory die comprising an array of Flash memory cells.
 10. The memorydevice of claim 1 further comprising a programmable register to indicatea range of address values that are common between the array of volatilestorage cells and the array of non-volatile storage cells.
 11. Thememory device of claim 1 wherein the information associated with thememory access operation comprises an input address value, and whereinthe shared interface circuit comprises a comparator circuit to comparethe input address value with an address value that indicates a startaddress within either the first storage die or the second storage die.12. The memory device of claim 11 wherein the comparator circuitgenerates a comparison result that indicates whether the input addressvalue falls within an address range of the first storage die or anaddress range of the second storage die.
 13. The memory device of claim12 wherein the memory access operation is carried out within the firststorage die if the comparison result indicates that the input addressvalue falls within the address range of the first storage die, andwithin the second storage die if the comparison result indicates thatthe input address value falls within the address range of the secondstorage die.
 14. A method of accessing storage locations within anintegrated circuit (IC) device, the method comprising: receiving, withina shared interface of the IC device, information that specifies a memoryaccess to be performed within either a first IC storage die having anarray of volatile storage cells or a second IC storage die having anarray of non-volatile storage cells; selecting either the first ICstorage die or the second IC storage die via selection circuitry basedon the information; and performing the memory access within either thefirst IC storage die or the second IC storage die according to theinformation.
 15. The method of claim 14 wherein the informationcomprises an address value, and wherein performing the memory accesswithin either the first IC storage die or the second IC storage dieaccording to the information comprises performing the memory accesswithin either the first IC storage die or the second IC storage dieaccording to one or more bits within the address value.
 16. The methodof claim 15 wherein performing the memory access within either the firstIC storage die or the second IC storage die according to one or morebits within the address value comprises performing the memory accesswithin either the first IC storage die or the second IC storage dieaccording to whether the address value falls within an address range ofthe first IC storage die or an address range of the second IC storagedie.
 17. The method of claim 14 wherein the information comprises amemory access command that indicates which of the first and secondstorage dice is to be accessed in a memory access operation and whereinperforming the memory access within either the first IC storage die orthe second IC storage die according to the information comprisesperforming the memory access within either the first IC storage die orthe second IC storage die according to one or more bits within thememory access command.
 18. The method of claim 14 wherein the first ICstorage die is a dynamic random access memory (DRAM) die comprising anarray of DRAM memory cells.
 19. The method of claim 14 wherein thesecond IC storage die is a Flash memory die comprising an array of Flashmemory cells.
 20. A memory device comprising: a first storage die havingan array of volatile storage cells; a second storage die having an arrayof non-volatile storage cells; means for receiving, within a sharedinterface of the memory device, information that specifies a memoryaccess to be performed within either the first storage die or the secondstorage die; means for selecting either the first storage die or thesecond storage die based on the information; and means for performingthe memory access within either the first storage die or the secondstorage die according to the information.
 21. Non-transitorycomputer-readable media having information embodied therein thatincludes a description of an integrated circuit memory device, theinformation including descriptions of: a first storage die having anarray of volatile storage cells; a second storage die having an array ofnon-volatile storage cells; a shared interface circuit to receiveinformation associated with a memory access operation to be performedwithin the memory device, the information specifying an access to eitherthe first or the second storage die, the shared interface circuitincluding selection circuitry responsive to the information and toselect, according to the information, either the first storage die orthe second storage die to be accessed in the memory access operation.